The effect of acid etching and rebonding on microleakage of a HEMA free adhesive.

dc.contributor.author	Uysal, Ömer
dc.contributor.author	TEKÇE, NESLİHAN
dc.contributor.author	ERDİLEK, DİNA
dc.contributor.author	DEMİRCİ, MUSTAFA
dc.contributor.author	TUNCER, SAFA
dc.date.accessioned	2021-03-06T11:30:48Z
dc.date.available	2021-03-06T11:30:48Z
dc.identifier.citation	TEKÇE N., DEMİRCİ M., TUNCER S., ERDİLEK D., Uysal Ö., "The effect of acid etching and rebonding on microleakage of a HEMA free adhesive.", EFCD 5. Conseuro 2011 İstanbul, İstanbul, Türkiye, 13 - 15 Ekim 2011, cilt.15, ss.841
dc.identifier.other	vv_1032021
dc.identifier.other	av_ef5c1842-81ad-416b-8114-ed77e234211f
dc.identifier.uri	http://hdl.handle.net/20.500.12627/157113
dc.language.iso	eng
dc.title	The effect of acid etching and rebonding on microleakage of a HEMA free adhesive.
dc.type	Bildiri
dc.contributor.department	Diğer Kurumlar , ,
dc.identifier.volume	15
dc.contributor.firstauthorID	455227

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