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dc.contributor.authorSarikaya, AT
dc.contributor.authorGunel, Tuba
dc.contributor.authorArda, N
dc.contributor.authorTemizkan, G
dc.contributor.authorAkman, G
dc.contributor.authorErcan, F
dc.contributor.authorSan, T
dc.date.accessioned2021-03-04T10:15:00Z
dc.date.available2021-03-04T10:15:00Z
dc.date.issued2001
dc.identifier.citationSarikaya A., Gunel T., Arda N., San T., Ercan F., Akman G., Temizkan G., "Effect of nikel on growth and ultrastructure of Schizosaccaromyces pombe", BIOTECHNOLOGY & BIOTECHNOLOGICAL EQUIPMENT, cilt.15, sa.1, ss.65-68, 2001
dc.identifier.issn1310-2818
dc.identifier.otherav_6c32dadd-2355-4770-aa22-cccf0e63a7f5
dc.identifier.othervv_1032021
dc.identifier.urihttp://hdl.handle.net/20.500.12627/74815
dc.identifier.urihttps://doi.org/10.1080/13102818.2001.10819107
dc.description.abstractIn this project, we investigated effects of nickel (Ni) on the growth and ultrastructure of Schizosaccharomyces pombe wild type strain. It was found that cells were tolerant against a concentration of 2 mM Ni+2 but the generation time was extended to 5 hours from 2.5 hours for the cells growing in Ni-free YEP medium. 76% of Ni+2 was removed in 30 min by the cells grown in YEP containing 1mM Ni+2. We also analyzed the ultrastructural modifications of the cells grown in 1 mM Ni+2. There was a visible thickening of the cell wall and increase in the number of small cytoplasmic vesicles. The plasma membrane appeared irregular compared to smoother contour in control. Vacuoles contained large amounts of electron-dense materials and the size of vacuoles also increased.
dc.language.isoeng
dc.subjectBiyoteknoloji
dc.subjectYaşam Bilimleri
dc.subjectBİYOTEKNOLOJİ VE UYGULAMALI MİKROBİYOLOJİ
dc.subjectYaşam Bilimleri (LIFE)
dc.subjectMikrobiyoloji
dc.subjectTemel Bilimler
dc.titleEffect of nikel on growth and ultrastructure of Schizosaccaromyces pombe
dc.typeMakale
dc.relation.journalBIOTECHNOLOGY & BIOTECHNOLOGICAL EQUIPMENT
dc.contributor.department, ,
dc.identifier.volume15
dc.identifier.issue1
dc.identifier.startpage65
dc.identifier.endpage68
dc.contributor.firstauthorID127397


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