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dc.contributor.authorAydin, Ismail
dc.contributor.authorErgin, M. Fatih
dc.date.accessioned2021-03-04T18:06:35Z
dc.date.available2021-03-04T18:06:35Z
dc.identifier.citationErgin M. F. , Aydin I., "Finite Element Analysis and Simulation of Rheological Properties of Bulk Molding Compound (BMC)", 3rd International Congress on Advances in Applied Physics and Materials Science, Antalya, Türkiye, 24 - 28 Nisan 2013, cilt.1569, ss.177-180
dc.identifier.othervv_1032021
dc.identifier.otherav_88fd5db9-16a5-4917-ae69-8ec8297ea037
dc.identifier.urihttp://hdl.handle.net/20.500.12627/92931
dc.identifier.urihttps://doi.org/10.1063/1.4849253
dc.description.abstractBulk molding compound (BMC) is one of the important composite materials with various engineering applications. BMC is a thermoset plastic resin blend of various inert fillers. fiber reinforcements, catalysts, stabilizers and pigments that form a viscous, molding compound. Depending on the end-use application, bulk molding compounds are formulated to achieve close dimensional control, flame and scratch resistance, electrical insulation, corrosion and stain resistance, superior mechanical properties, low shrink and color stability. Its excellent flow characteristics, dielectric properties, and flame resistance make this thermoset material well-suited to a wide variety of applications requiring precision in detail and dimensions as well as high performance. When a BMC is used for these purposes, the rhcological behavior and properties of the BMC is the main concern.
dc.language.isoeng
dc.subjectTemel Bilimler
dc.subjectMühendislik ve Teknoloji
dc.subjectFizik
dc.subjectTemel Bilimler (SCI)
dc.subjectFİZİK, UYGULAMALI
dc.subjectMühendislik, Bilişim ve Teknoloji (ENG)
dc.subjectMalzeme Bilimi
dc.subjectMALZEME BİLİMİ, MULTIDISCIPLINARY
dc.titleFinite Element Analysis and Simulation of Rheological Properties of Bulk Molding Compound (BMC)
dc.typeBildiri
dc.contributor.departmentİstanbul Üniversitesi , Mühendislik Fakültesi , Kimya Mühendisliği Bölümü
dc.identifier.volume1569
dc.contributor.firstauthorID55687


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